TESTIMONIALS
“In our PCB design flow, we have very strict electrical and mechanical requirements that we need to manage across 20+ layers for most designs. Until now, we haven’t found a software solution that was able to capture the layer of detail that we require in our design process. We’ve found that Z-zero software reduces the time it takes us to specify and validate fabricator stackups. We can evaluate three different stackups in an hour, rather than a day, and it significantly reduces the amount of back-and-forth communication required with our fabricators and NPI team.”
- Dr. Jayaprakash Balachandran is a Senior Technical Leader Signal Integrity Engineering at Cisco Systems
“Survival in the world of high-speed design requires accurate prediction of electrical performance based on design and material properties. Z-zero’s focus on accurately modeling the detailed elements of PCB stackups is a valuable contribution to the industry.”
-Dr. Eric Bogatin is an industry pioneer; author of “Signal and Power Integrity–Simplified;" Co-author of the follow-on, “Principles of Power Integrity for PDN Design–Simplified: Robust and Cost Effective Design for High Speed Digital Products.”
“I work on “advanced technology” designs. Some of these require very unique stackups and I generally work them out before going to fabricators for their inputs. Usually, I mandate that they follow them exactly once we lock them down. We can’t afford changes from fabricator to fabricator. This is particularly true as speeds and frequencies go up.
Materials play a key role. The loss modeling helps us quickly determine what level of material performance we need and sometimes we can make lower cost materials work just by changing the stackups in the early design concept.
We follow up with detailed SI modeling, but Z-solver* enables us to quickly get to what we need for materials/stackup.”
- Principal Engineer, Advanced Technology, Leading Wireless Base Station Manufacturer
Learn More
Z-zero, based in
Redmond, Washington, develops
PCB stackup planning and
material-selection software
for electronic-system design.
